Topics & Abstracts
"TMMi, TPI and Co. - Comparison of different test process improvement models" - Comparison of different test process improvement models such as TMMi, TPI Next, ISO/IEC 33063 with TMMi case study

Test process improvement is a topic which receives more and more attention from the market of the last couple of years. Following the basic idea of CMM the first test process improvement model, the Test Maturity Model (TMM), was developed almost twenty years ago. Since then a number of other models, TPI, TPI Next, TMMi, TestSPICE have evolved.

After a brief overview the presentation will focus on the latest models TPI Next and TMMi and give a case study. In addition the results of a recently conducted survey on the usage of test tools and test models in industry will be presented. The talk will close with an outlook ISO/IEC 33063, the first internationally agreed standard on a process assessment model for software testing which is currently being developed.

  Biography
  Dr. Klaudia Dussa-Zieger studied computer science at the University of Erlangen-Nuremberg. Following her master studies at the University of Maryland, USA, she gained her PhD in computer science at the University of Erlangen-Nuremberg in 1998. She worked for several years as a consultant for software testing and quality assurance as well as software process improvement. In 2006 she began working for Method Park Software AG.
One of her interests is on the practical implementation of relevant industrial
standards. She is head of the DIN working group 043-01-07 AA „System and Software Engineering“. Klaudia Dussa-Zieger is iNTACSTM Competent Assessor (ISO/IEC 15504) for Automotive SPICE and since 2004 qualified as an ISTQB Certified Tester Full Advanced Level and trainer for ISTQB CT Foundation and Advanced Level.

At the ASQF e.V. she heads the expert group for software testing. Klaudia Dussa-Zieger also holds a lecture at the University of Erlangen-Nuremberg on the topic of testing software systems, and she is co-author of the book “Software Engineering nach Automotive SPICE”